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Photonic Interconnects Aim to Solve AI Memory Bottlenecks
Photonic interconnects by Celestial AI aim to solve AI memory bottlenecks with optical fabric and chiplets for enhanced bandwidth.
Siemens and TSMC Boost IC Design Collaboration
Siemens and TSMC enhance IC design collaboration with advanced processes and certifications for innovative chip manufacturing.
Siemens and TSMC Boost Semiconductor Innovation
Siemens and TSMC collaborate to advance semiconductor innovation with EDA tools and cutting-edge process nodes for AI and automotive tech.