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Siemens Digital Industries Software and TSMC have expanded their partnership to develop new projects, certify products, and drive innovation using TSMC¡¯s advanced processes. By integrating Siemens¡¯ EDA solutions with TSMC¡¯s leading chip manufacturing and advanced packaging technologies, the collaboration enables their mutual customers to create highly differentiated end products.
N2 and N3 Certifications
Siemens¡¯ Calibre nmPlatform tools have achieved certification for TSMC¡¯s N2 and N2P processes. The N2 certification includes the new LSVRF (Local Standard Verification Rules Format) feature in Calibre, enabling independent rule checks within specific processor regions for optimal verification accuracy. The partnership also covers TSMC¡¯s N2 certification of Siemens¡¯ Calibre xACT software.
Siemens and TSMC collaborated to certify tools in Siemens¡¯ Solido Simulation Suite for analog, mixed-signal, RF, and memory designs. Solido SPICE and Analog FastSPICE (AFS) tools are now certified for TSMC¡¯s N2 and N2P processes. As part of TSMC¡¯s N2 Custom Design Reference Flow (CDRF), Siemens¡¯ AFS tools support reliability-aware simulation to address IC aging and real-time self-heating effects, alongside other advanced reliability features. The N2 CDRF also integrates Siemens¡¯ Solido Design Environment for advanced variation-aware verification.
To support next-generation physical implementation, TSMC certified Siemens¡¯ Aprisa place-and-route software for its N3E and N3P processes, offering Aprisa customers enhanced performance and power efficiency.
Expanded Collaboration
Siemens and TSMC are extending their partnership into silicon photonics, developing a process methodology to leverage TSMC¡¯s Compact Universal Photonic Engine (COUPE) technology through Siemens¡¯ tools. Ongoing projects include Siemens¡¯ Tanner software for custom photonic IC design, Xpedition Substrate Integrator for system assembly, and Calibre 3DStack for physical verification of COUPE integrated systems.
The companies also collaborated to define and test Calibre 3DThermal, Siemens¡¯ new thermal analysis solution for verifying and debugging advanced 3D ICs.
Siemens has joined TSMC¡¯s Design Center Alliance (DCA), offering a broad service portfolio to support TSMC customers, from startups to large enterprises. These services cover critical IC design stages, including place-and-route, design-for-test, functional verification, hardware-accelerated simulation, custom memory development, and IC packaging. Global customers have partnered with Siemens¡¯ services to launch products for AI, high-performance computing, and other fast-growing markets.
As part of TSMC¡¯s Secure Chamber cloud program, Siemens and TSMC have successfully run Calibre, mPower, and AFS toolsets on AWS. This initiative demonstrates the accuracy of TSMC¡¯s N3/N2-certified tools in cloud environments, leveraging virtual secure isolation to optimize performance and resolve issues, streamlining tape-out processes and improving outcome quality.
