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Features and Uses of Four IC Packaging Types
Explore the features and uses of four IC packaging types: DIP, SOP, COB, and BGA, crucial for chip protection and performance.
Siemens and TSMC Boost IC Design Collaboration
Siemens and TSMC enhance IC design collaboration with advanced processes and certifications for innovative chip manufacturing.
Siemens and TSMC Boost Semiconductor Innovation
Siemens and TSMC collaborate to advance semiconductor innovation with EDA tools and cutting-edge process nodes for AI and automotive tech.