ALLPCB
Samtec, Broadcom Demo 200G Copper at DesignCon
Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers.
Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers.
PCIe 7.0 final draft hits 128 GT/s, doubling PCIe 6.0 speed for AI, data centers, and high-performance computing with optical innovations.