Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style><p> The difference between the bypass capacitor and the decoupling capacitor </p><p><img src="https://file.allpcb.com/bbs/17/05/20/153639701.gif"/> </p><p> 1. Decoupling: Removes RF energy from the high frequency device to the distribution network when the device is switched. The decoupling capacitor can also be a localized DC voltage source for the device, which is particularly useful in reducing cross-board inrush current. </p><p> 2. Bypass: Remove unwanted common-mode RF energy from components or cables. This is mainly through the generation of AC bypass to eliminate unintentional energy into the sensitive part, in addition to providing baseband filtering function(bandwidth is limited). </p>