Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p"> When the line conductor to be electroplated is isolated and cannot be used as an electrode, only electroless plating can be performed. General chemical plating used in the bath has a strong chemical effect, and chemical gold plating process is a typical example. Electro less gold plating is a very high alkaline aqueous solution. When using this plating, it is prone to drill under the coating layer, especially if the cover film laminating process quality management is not strict with low bonding strength, this problem can happen more easily. </div> <div class="e_img"> <img src="https://file.allpcb.com/bbs/17/05/08/105707827.jpg" width="600" height="512" /> </div> </div>