Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style><p><img src="https://jpfile1.oss-cn-shenzhen.aliyuncs.com/allpcb/web/image/20190605/6369534638744535652439320.jpg" alt="173127961.jpg"/></p><p><span style="font-size:16px;">Due to a significant reduction in weight and volume and bending flexibility, FPC meets the trend of light and flexible electronic products, and is gradually to replace the hard board in the connection function as the main electronic equipment in the connection accessories.</span></p><p><span style="font-size:16px;">Unlike the decentralized PCB market, the global segment of the FPC industry is highly centralized, first-line manufacturers are relatively stable with strong bargaining power, but this as the world&#39;s largest FPC buyers: Apple open motherboard upgrade and rebuild the PCB global supply chain, accelerating FPC production eastward and local manufacturers to promising expand production.</span></p><p><span style="font-size:16px;">It is Apple firmly support FPC technology and open consumer electronics soft board era. On the tenth anniversary of the Apple phone, we judge the functional innovation represented by OLED, 3D camera, biometrics and wireless charging, and the upcoming 5G era will enhance the FPC in the intelligent machine penetration. The wide application of the new function will bring the number of BOM entries and subdivision values generally rise, bringing new growth space of FPC.</span></p>