Description

<p style="white-space:pre-wrap;line-height:1.75;font-size:14px;"> The latest class carrier board is processed into Apple iPhone 8 new machine this year, driving Taiwan PCB supply chain operations to add new kinetic energy. This year Apple will launch iPhone 8, and because the line transmission adopt carrier board SLP line width specifications, three models of the motherboard launched this year is determined to use class carrier process. </p> <p style="white-space:pre-wrap;line-height:1.75;font-size:14px;"> <br /> </p> <p style="text-align:center;white-space:pre-wrap;line-height:1.75;font-size:14px;"> <img src="https://file.allpcb.com/bbs/17/05/08/114812008.jpg" alt="" /> </p> <p style="text-align:center;white-space:pre-wrap;line-height:1.75;font-size:14px;"> <br /> </p> <p style="white-space:pre-wrap;line-height:1.75;font-size:14px;"> According to the reports, i8 motherboard specifications will upgrade and let the board for the first time to enter the motherboard area. It is speculated that high-end smart phone from Korean manufacturers and mainland China brands will be introduced class carrier board design in 2018. </p> <p style="white-space:pre-wrap;line-height:1.75;font-size:14px;"> <br /> </p> <p style="text-align:center;white-space:pre-wrap;line-height:1.75;font-size:14px;"> <img src="https://file.allpcb.com/bbs/17/05/08/114655549.png" alt="" style="font-size:14px;line-height:24.5px;white-space:pre-wrap;text-align:center;" /> </p>