Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p"> <span style="font-size:16px;">When using flexible printed boards, there are width differences in the wires; this is more likely to result in uneven thickness of the coating. To prevent this from happening, it is possible to attach a diversion cathode pattern to absorb uneven current distributed over the plating pattern, maximizing the uniform thickness of the coating on all locations.</span> </div> <div class="e_img"> <img src="https://file.allpcb.com/bbs/17/05/08/103912716.jpg" alt="" width="500" height="358" title="" align="" /><br /> </div> </div>