Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p"> I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contamination levels (dendritic growth) found on our boards, 20 - 80 ug/in^2. The test,Ionic Contamination (Electromigration) Test , was performed on 5 PCBA boards by an outside lab using IPC-TM-650 2.6.14 Rev. A standards. My question is, what could be the root cause. Could it be the no-clean flux? If so, what type of flux should be used to reduce the contamination levels? As part of a containment action all boards will be washed. Please help. Thank you. </div> </div>