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Samtec, Broadcom Demo 200G Copper at DesignCon
Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers.
Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers.
Western Digital and Hon Hai partner for AI storage with innovative TOR EBOF switch, enhancing data center efficiency for AI workflows.