
ESD Implementation Strategies for Amplifier Inputs
Guide to internal ESD diodes and overvoltage protection for amplifier inputs, covering diode topologies, current limiting, thermal effects, and electromigration.
Guide to internal ESD diodes and overvoltage protection for amplifier inputs, covering diode topologies, current limiting, thermal effects, and electromigration.
Practical engineering guide to Pierce oscillator design: crystal equivalent model, load capacitance tuning, startup/gain margin checks, drive-level and PCB layout recommendations.
Technical guide to inductors and inductance: covers permeability, resistance, core loss, saturation, self-resonant frequency, ripple and selection for DC/DC converters.
Overview of MOSFET gate drive principles, gate-to-source capacitance and gate charge, threshold behavior, and gate charge calculation for driver circuit design.
Analysis of China SiC substrate price decline in 2024: domestic prices plunged vs global quotes, driven by capacity expansion, competition and potential price war.
Summary of common diode applications in LDO circuits: reverse-connection protection, GND isolation, input-output clamping, and output drop/backfeed prevention.
Guidance on terminating unused op amp sections and comparators to avoid floating inputs: use voltage followers to set inputs to ground or VCC/2.
Review of silicon carbide (SiC) power devices covering principles, key characteristics, applications and challenges for high-efficiency power electronics and energy conversion.
Analysis of silver sintering and copper wire bonding for SiC power devices, comparing sintering methods, substrate surface effects and thermal-shock impact on reliability.
MOSFET technical summary of electrical and thermal specs: key ratings (VDSS, VGS, ID), thermal resistance RθJA and Tj calculation, capacitances, gate charge and switching timings.
Technical analysis of IGBT switching with diode?clamped inductive load: interval-by-interval turn-on/turn-off waveforms, diode recovery, tail current, and driver requirements.
Overview of Schottky diode characteristics and usage notes, including forward voltage, reverse leakage behavior, and why paralleling identical diodes risks unequal current sharing.
Overview of diode clamp and clamping circuit operation, positive/negative and bias clamps, RC time-constant design, component selection, and protection applications.
Practical derating guidelines for power-supply components: rules, accelerated-test models, and component-specific limits (ICs, capacitors, MOSFETs, resistors) for reliability.
Technical overview of silicon carbide substrate production comparing PVT, liquid-phase and HTCVD crystal growth methods, challenges and advances in scaling low-defect wafers.
Summarizes nine standard circuit design modules - power module, IO, op amp decoupling, high-speed termination, ground return, test points - to improve PCB design reliability.
Explains how an inverting amplifier's low input impedance (equal to Rin) and source internal resistance reduce closed-loop gain, causing gain error and instability.
Technical overview of MOSFET gate functions and drive implementations, including direct drive, external drivers, speed?up diode, PNP turn?off, floating and isolated drives.
Switch-mode regulator troubleshooting: inductor overheating and unstable SW traced to inappropriate output capacitor ESR; replacing with ceramic/tantalum restored loop stability.
Technical overview of silicon carbide (SiC) power devices: operation, benefits, applications, challenges and future trends for high-temperature, efficient power electronics.